Reflow Ovent T-962C
Maximum soldering area: 400 × 600 mm
Size: 68.4X50.4X22.5 cm
Rated power: 2500W
Process period: 1 ~ 8 min





Infrared Reflow Oven T-962C – MICROCHIPS
TheT-962Cis a standalone microprocessor-controlled reflow oven, designed for precision soldering of electronic components on large surfaces. Thanks to its infrared heating technology and air circulation, it is the ideal solution for prototyping laboratories and small batch productions that require uniform thermal distribution.
Main Features:
Upper Working Area: Offers one of the largest soldering areas in its category, with a tray of 400 x 600 mm, allowing for the simultaneous processing of multiple large format boards or PCBs.
Intelligent Temperature Control: Incorporates eight (8) predefined soldering cycles that can be easily selected from its LCD screen, covering a wide range of thermal requirements for lead and lead-free soldering.
Efficient Cooling System:Equipped with exhaust channels and high-power fans to ensure rapid cooling of the boards, protecting sensitive components after the reflow process.
Component Versatility:Specifically designed to handle complex components such as CHIP, SOP, PLCC, QFP, and BGA, ensuring flawless solder joints.
Technical Specifications:
| Parameter | Technical Detail |
| Maximum Soldering Area | 400 x 600 mm |
| Nominal Power | 2500W |
| Temperature Range | 0°C - 280°C |
| Cycle Time | 1 to 8 minutes |
| Power Supply | AC 110V/220V 50/60Hz |
| Heating Method | Infrared Radiation + Circulating Air |
Microcircuit Commitment
With theT-962C, in Microcircuitos we guarantee a robust and easy-to-operate tool that automates the entire process: from preheating to final cooling. It is the perfect investment to scale your electronic production to industrial standards.