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NeoDen Reflow Oven IN8C


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Technical Specification and Manufacturing Architecture: NeoDen IN8C

The NeoDen IN8C is a high-performance forced convection reflow oven, optimized for surface mount technology (SMT) processes that require high thermal repeatability in a compact form factor. Its architecture is designed to meet the demands ofLead-Freesoldering and thermal management of complex substrates.

1. Thermal Dynamics and Process Control

The system implements closed-loop control using PID (Proportional-Integral-Derivative), ensuring critical thermal stability for sensitive components.

  • Processing Zones: Configuration of 8 independent zones(4 upper and 4 lower), allowing precise profiling of the phases ofPre-heat, Soak, ReflowandCooling.

  • Heat Transfer: Uses high thermal inertia aluminum microcirculation plates. This design minimizes the transverse temperature gradient ($\Delta T$) across the PCB, ensuring that components at the ends receive the same heat input as those in the center.

  • Operational Precision: Maximum thermal deviation of ±1°C in steady state.

2. Transport and Mechanical Engineering

The transport system is designed to integrate into automated production lines (optional SMEMA compatible) or operate in astand-alone.

  • Drive Mechanism: Suspended rail chain transport system, adjustable for PCB widths of up to 330 mm.

  • Synchronization: Precision motorization with an adjustable speed range between 50 mm/min and 600 mm/min, allowing adjustment of the dwell time (Dwell Time) according to the thermal mass of the board.

3. Emission Management and Sustainability (Eco-Design)

One of the competitive advantages of the IN8C is its focus on simplified infrastructure:

  • Integrated HEPA Filtration: Stage smoke purification system (activated carbon and particle filtration), eliminating the need for external extraction ducts and facilitating deployment in laboratory or rapid prototyping environments.

  • Energy Efficiency: Optimized consumption through high-density thermal insulation, maintaining average operational consumption at 1.5 kW.

Metrics

SpecificationTechnical Metric
Profiling CapacityInternal storage of up to 40 thermal curves
Heating ArchitectureTotal convection by hot air (Full Hot Air)
Length of the Heating Zone1000 mm
Maximum Temperature Range300°C (Compatible with SAC305 alloys)
Cooling SystemForced axial airflow (4 fans)
User InterfaceIndustrial touchscreen with real-time curve display

 

4. Compliance and Applications

The NeoDen IN8C is designed to meet the standardsIPC-J-STD-001regarding the integrity of solder joints. It is ideal for:

  1. NPI (New Product Introduction): Development of functional prototypes.

  2. Low/Medium Volume Production: Assembly of medical, aerospace, and consumer devices.

  3. Certified Environments: Laboratories that require strict control of volatile emissions (VOCs).

Technical Specifications

ParameterDetail
Heating Zones8 zones (4 upper / 4 lower)
Cooling Zones1 zone (4 fan system)
Maximum PCB Width330 mm
Transport ModeChain / Rail (Automatic orbital)
Conveyor Speed50 – 600 mm/min
Temperature RangeEnvironment up to 300°C
Temperature Accuracy±1°C
Heating Time20 - 30 minutes
Power ConsumptionStartup: ~3.6 kW / Operation: ~1.5 kW
Dimensions1660 x 607 x 1075 mm (Vertical with base)
Weight200 kg