NeoDen Reflow Oven IN8C
Technical Specification and Manufacturing Architecture: NeoDen IN8C
The NeoDen IN8C is a high-performance forced convection reflow oven, optimized for surface mount technology (SMT) processes that require high thermal repeatability in a compact form factor. Its architecture is designed to meet the demands ofLead-Freesoldering and thermal management of complex substrates.
1. Thermal Dynamics and Process Control
The system implements closed-loop control using PID (Proportional-Integral-Derivative), ensuring critical thermal stability for sensitive components.
Processing Zones: Configuration of 8 independent zones(4 upper and 4 lower), allowing precise profiling of the phases ofPre-heat, Soak, ReflowandCooling.
Heat Transfer: Uses high thermal inertia aluminum microcirculation plates. This design minimizes the transverse temperature gradient ($\Delta T$) across the PCB, ensuring that components at the ends receive the same heat input as those in the center.
Operational Precision: Maximum thermal deviation of ±1°C in steady state.
2. Transport and Mechanical Engineering
The transport system is designed to integrate into automated production lines (optional SMEMA compatible) or operate in astand-alone.
Drive Mechanism: Suspended rail chain transport system, adjustable for PCB widths of up to 330 mm.
Synchronization: Precision motorization with an adjustable speed range between 50 mm/min and 600 mm/min, allowing adjustment of the dwell time (Dwell Time) according to the thermal mass of the board.
3. Emission Management and Sustainability (Eco-Design)
One of the competitive advantages of the IN8C is its focus on simplified infrastructure:
Integrated HEPA Filtration: Stage smoke purification system (activated carbon and particle filtration), eliminating the need for external extraction ducts and facilitating deployment in laboratory or rapid prototyping environments.
Energy Efficiency: Optimized consumption through high-density thermal insulation, maintaining average operational consumption at 1.5 kW.
Metrics
| Specification | Technical Metric |
| Profiling Capacity | Internal storage of up to 40 thermal curves |
| Heating Architecture | Total convection by hot air (Full Hot Air) |
| Length of the Heating Zone | 1000 mm |
| Maximum Temperature Range | 300°C (Compatible with SAC305 alloys) |
| Cooling System | Forced axial airflow (4 fans) |
| User Interface | Industrial touchscreen with real-time curve display |
4. Compliance and Applications
The NeoDen IN8C is designed to meet the standardsIPC-J-STD-001regarding the integrity of solder joints. It is ideal for:
NPI (New Product Introduction): Development of functional prototypes.
Low/Medium Volume Production: Assembly of medical, aerospace, and consumer devices.
Certified Environments: Laboratories that require strict control of volatile emissions (VOCs).
Technical Specifications
| Parameter | Detail |
| Heating Zones | 8 zones (4 upper / 4 lower) |
| Cooling Zones | 1 zone (4 fan system) |
| Maximum PCB Width | 330 mm |
| Transport Mode | Chain / Rail (Automatic orbital) |
| Conveyor Speed | 50 – 600 mm/min |
| Temperature Range | Environment up to 300°C |
| Temperature Accuracy | ±1°C |
| Heating Time | 20 - 30 minutes |
| Power Consumption | Startup: ~3.6 kW / Operation: ~1.5 kW |
| Dimensions | 1660 x 607 x 1075 mm (Vertical with base) |
| Weight | 200 kg |





